Silicon

• Integrated circuits changed computer circutries
• Circuts's sillicon purified as polycillion chunks
  • The cubic seed will form a new cubic sillicon
  • Impurities added to sillicon to cause it to conduct
  • Negative charged free carrier (asinic) => n type
  • Positive charged carrier (boron) => p type
• Christle ground to form ingots
• Then, sliced thin as wafers
• Wafers are then ground thin + removed of surface contaminates
• Then, wafers are checked for resistivity
• CMOS
  • n-type transitior sandwich a p type region
  • A charge on the gate wolud cause the charge to go through from source => drain
  • Vise, versa
• Meaning, when the P-N circut combinations are on, the N-P combination is off
  
• High temperature used to grow sillicon dioxide to protect the sillicon as sillicon interacts with pure exygen
• Photoresist smeared on the wafer, and light is exposed to each part to etch patters
• Then, lazers/plasma/acid guides etching of the wafer suface
• Plasma implimant impurities to cause conductivity
• Photoresist then washed off
• The wafer is then cleaned off

Then, the actual circut wires are introduced:

1. Deposition of sillican oxite
2. Photolithagraphy, masking + etching
3. Depositivion of tusten as pulig
4. Deposition + potterning of alluminum alloy as wires

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Lastly, the water is put into pieces to be placed onto circuts.